Description: Thin Film: Multichip Modules Intl Society for Hybrid Microelectronics 1992 Illus Click images to enlarge Description ?Thin Film: Multipchip ModulesBy George Messner, Iwona Turlik, John W. Blade, & Philip E. Garrou Published by International Society for Hybrid Microelectronics in 1992 Like new copy; IllustratedVery slight yellowing of coverBox: 045-2020 Condition: Like New Payment Paypal Shipping Domestic shipping: Fixed Shipping Charges.International shipping: Weight based Shipping Charges. International Carriers are: Usps Priority Intl Shipping Carrier Domestic International Shipping Locations Usps Book Rate$0.00-- I will ship to: United States, Worldwide Weight: 3 lbs. 2 oz. Shipping and Handling: Please check eBay's Shipping & Payment tab Thank you for visiting the Juniata General Store. We are located in the heart of Central Pennsylvania just up the road from the beautiful Juniata River. We offer a wide variety of merchandise, both new and vintage. Most of our inventory is one of a kind items and we add new items constantly so check back often. Vendio Images: More than just a pretty image. 250+ Mobile Responsive & Active Content Free Listing Templates with Vendio Sales Manager. Vendio provides powerful selling automation for sellers of all sizes. Get business information that counts! - Vendio Counters are active content free.
Price: 17.99 USD
Location: Newport, Pennsylvania
End Time: 2024-02-29T01:43:32.000Z
Shipping Cost: 0 USD
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Item Specifics
Restocking Fee: No
Return shipping will be paid by: Seller
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
Subjects: Engineering & Technology
MPN: Does not apply
Format: Paperback
Title: Thin Film: Multichip Modules
Modified Item: No
Topic: Microelectronics
Language: English
Publication Year: 1992
Book Title: The Film:Multichip Modules
Intended Audience: Adults
Author: George Messner, Iwona Turlik, John W. Balde, Philip E. Garrou
Publisher: International Society for Hybrid Microelectronics
Genre: Engineering & Technology
