Description: Lead-Free Solder Paste Content: Tin 64% Bi 35%Ag1%, Solder Flux Content: 10.0% Electronics Soldering Paste - Low Temperature Solder Paste With Flux, Melting Point: 183 ℃ (361F) Product Advantages: Pushing-Type Design Smoother Flowing No Wasting During Welding Suitable For Paper Boards Or Soft Boards That Cannot Withstand High Temperatures, Special Welding Of Small Components Widely Used In BGA /SMD Circuit Board, Motors, Lighting, IC, TV and Other Household Appliances And Electronics Soldering Industrial Equipment, Sensors, Wires, Fuses, , Metal Shells, Motors, Lighting, Connectors, ,SMT Maintenance
Price: 19.42 USD
Location: Winchester, Kentucky
End Time: 2025-01-11T05:50:10.000Z
Shipping Cost: 0 USD
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Item Specifics
Return shipping will be paid by: Seller
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
Return policy details:
Size: Sn64Bi35Ag1
Package Dimensions LxWxH: 6.73x3.7x1.06 Inches
Weight: 0.11 Pounds
Type: Does not apply
Brand: Essmetuin
