- Minus Pad 8 (100x100x2,0mm) - Self-Adhesive Cooling Conductive Thermal Pad ...

Description: has been a leading manufacturer of cooling components for computers and consoles such as PS4, PS3, Xbox 360 and Xbox One X for years. The company's products are considered reliable and durable and have their fans all over the world. High-performance thermal inserts from the Minus Pad 8 series have a very flexible and flexible surface with very high thermal conductivity. Even the smallest differences in components can be compensated very well. Available in various sizes and thicknesses. Thermopad Minus Pad 8 is a perfect solution for beginners who want to provide great thermal conductivity and optimize the operation of their cooling systems. After the first use, you can immediately see a significant drop in temperature, but not only. You'll also notice a significant drop in volume. The thermal pad from offers excellent compatibility with both air and liquid cooling systems. At the same time, it guarantees the absence of electrical conductivity and resistance to the passage of time, without hardening or loss of properties. Grizzly Thermal Pad has a thermal conductivity of 8.0 W/mk and a temperature range of -100 °C/+250 °C, it is perfect for configurations supporting extremely demanding applications, which makes it an ideal solution also for industrial environments. and at the same time protects the contact surfaces, preventing the formation of micro-cracks. It is ideal for water cooling and for components that will be subject to OC. Munus Pad 8 is characterized by high compressibility and flexibility as well as dielectric properties. After removing the Minus Pad 8 thermally conductive mat, there were significantly less scratches on the surfaces of the lubricated elements. Application of motherboard chipset, memory modules, graphics card memory, graphics card GPU, notebooks. THERMAL CONDUCTIVE PAD - It effectively dissipates significant amounts of heat thanks to its unique composition of Ceramic Silicone and Nano-Aluminum Oxide FLEXIBLE STRUCTURE - The thermal padding compensates for even the smallest gaps between components with its flexible structure and high heat conductivity USED IN VARIOUS SCENARIOS - It is utilized in situations where thermal paste cannot be applied, such as cases with large air gaps or uneven surfaces GREAT RESULTS - By filling small gaps with its flexible and highly conductive structure, the Thermal Pad effectively dissipates heat between components 8W/(m·K) THERMAL CONDUCTIVITY - With a highly conductive and versatile nature, it is suitable for a wide range of configurations with basic to high requirements

Price: 51.31 USD

Location: Seattle, Washington

End Time: 2024-12-29T10:35:31.000Z

Shipping Cost: 0 USD