Description: Design of 3D Integrated Circuits and Systems by Rohit Sharma Estimated delivery 3-12 business days Format Hardcover Condition Brand New Description Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text:Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-waferDiscusses the use of interposer technology and the role of Through-Silicon Vias (TSVs)Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs)Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applicationsDescribes large-scale integration testing and state-of-the-art low-power testing solutionsComplete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems. Author Biography Rohit Sharma is faculty at the Indian Institute of Technology Ropar, Punjab. He previously worked as a post-doctoral researcher at Seoul National University, South Korea and at Georgia Institute of Technology, Atlanta, USA. Dr. Sharma has authored/co-authored over 50 journal and conference publications, one book, one book chapter, two patents/copyrights, and several invited talks. He was a recipient of the Brain Korea Research Fellowship (2010), the Indo-US Research Fellowship (2011), and Best Paper Awards in ASQED 2010 and GIT 2011 conferences. An IEEE and ACM member, he has served as a journal referee and committee member/session co-chair on multiple occasions. Details ISBN 146658940X ISBN-13 9781466589407 Title Design of 3D Integrated Circuits and Systems Author Rohit Sharma Format Hardcover Year 2014 Pages 324 Publisher Taylor & Francis Inc GE_Item_ID:139829916; About Us Grand Eagle Retail is the ideal place for all your shopping needs! With fast shipping, low prices, friendly service and over 1,000,000 in stock items - you're bound to find what you want, at a price you'll love! Shipping & Delivery Times Shipping is FREE to any address in USA. Please view eBay estimated delivery times at the top of the listing. Deliveries are made by either USPS or Courier. We are unable to deliver faster than stated. International deliveries will take 1-6 weeks. NOTE: We are unable to offer combined shipping for multiple items purchased. This is because our items are shipped from different locations. Returns If you wish to return an item, please consult our Returns Policy as below: Please contact Customer Services and request "Return Authorisation" before you send your item back to us. Unauthorised returns will not be accepted. Returns must be postmarked within 4 business days of authorisation and must be in resellable condition. Returns are shipped at the customer's risk. We cannot take responsibility for items which are lost or damaged in transit. For purchases where a shipping charge was paid, there will be no refund of the original shipping charge. Additional Questions If you have any questions please feel free to Contact Us. Categories Baby Books Electronics Fashion Games Health & Beauty Home, Garden & Pets Movies Music Sports & Outdoors Toys
Price: 193.41 USD
Location: Fairfield, Ohio
End Time: 2024-12-06T06:01:18.000Z
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ISBN-13: 9781466589407
Book Title: Design of 3D Integrated Circuits and Systems
Number of Pages: 324 Pages
Language: English
Publication Name: Design of 3d Integrated Circuits and Systems
Publisher: CRC Press LLC
Subject: Electronics / Circuits / Integrated, Electrical
Publication Year: 2014
Item Height: 0.7 in
Type: Textbook
Item Weight: 21.3 Oz
Author: Rohit Sharma
Item Length: 9.6 in
Subject Area: Technology & Engineering
Series: Devices, Circuits, and Systems Ser.
Item Width: 6.3 in
Format: Hardcover